There is no vanilla element with such properties (yet.)  But you could use DMND in conjunction with airblock wall. DMND is a good heat conductor that doesn't melt and airblock wall would block pressure but allow elements to touch the DMND.

@SsaucySam (View Post)

 In case you don't want to go with a WALL less design, i would suggest using air block wall along with HEAC.

Alternatively, you can use the HEAC's special property that allows it to transfer heat over 4 pixel wide gaps with TTAN.

There are other ways too, involving serialisation and other stuff but those are slightly complicated.

I can also make a save illustrating some of these methods if you want.

You can make a line of particles like so:
[HEAC] [HEAC] [HEAC] [HEAC]
[FRME] [FRME] [FRME] [FRME]

[TTAN] [TTAN] [TTAN] [TTAN]

And like Jacob1 said, set the .tmp of the TTAN to 1. The heat from the HEAC jumps gaps, but it can only jump gaps of 3 pixels, so if they're only one particle apart the heat won't transfer between them, even if the FRME isn't there (though as far as I can tell, FRME does block the heat transfer even if the gap is right)

@jacob1 (View Post)

 INSL doesn't melt but it does burn.  ARAY might be better.  It doesn't melt or burn.  It also doesn't conduct heat so the TTAN would be safe from really hot elements.

ARAY is also a great instant conductor, so if you want instant transmission of electricity you can do it without stupid INSTANT cooldown.